My GL702VS lessons learned about cooling this thing.
I have repasted this thing more than 25 times trying different methods of TIM application, different TIM's, different external fan assistance etc. Here are my conclusions and best results and why I think I got these results.
All results are in a 75.5 F degree room.
Bottom drilled out with several holes in a pattern where fan centers are located
Single pci slot fan blowing toward the back center (I no longer tape it to the vent area, I just let it sit blowing toward me while it sits against the back center) See my thread for pics
https://rog.asus.com/forum/showthread.php?101225-GL702VS-Final-cooling-solution-for-7-00-Seriously-N...Two aquafina water bottle caps sitting under the back rubber feet. I like the slightly raised back for typing plus aids in cooling.
TIM's applied in a
very specific wayIn Windows cpu and gpu stressed maxed out:
Max temps cpu = 75 C ---Fan boost at 30% set in ROG Center
Max temps gpu = 69 C ---Fan boost at 30% set in ROG Center
In Linux cpu and gpu stressed maxed out:
Max temps cpu = 79 C ---No fan boost because I can't yet figure out how to do it in Linux
Max temps gpu = 71 C ---No fan boost
In Windows I used Intel tunning + furmark to torture, along with GTAV and Kerbal
In Linux I've used stress --cpu 8 + phoronix test suite, plus tested running kerbal
The max temps are exactly that..the max's. Most of the time they are sitting around 3-5deg cooler than max.
Only maxing out the CPU:
In Windows - 63C max (using intel tuning stress)
In Linux - 68C max (using stress --cpu
😎Now...How did I get this accomplished:
#1 In windows cpu is undervolted by -.125v by intel tuning
#2 In Linux cpu and gpu are undervolted by script -.125v
#3 In windows fan boost set to 30% boost
#4 Water bottle caps under the back rubber feet
#5 PCI slot fan just sitting on desk facing laptop point at the rear center vent area blowing toward me (no longer taped to vent area)
#6 Drilled holes in bottom panel in a pattern centered on fan intakes
#7 Used blue painters tape to tape gaps between fan cases and heat pipes (Do not use metalized tape it just puts more heat in the case)
#8 Applied thermal paste(s) in a VERY specific manner (this is the VERY important part)
*** I'm sure that my thermal paste choices and application methods could generate a lot of heated debate, but I assure you I have repasted this thing no less than 25 times trying all different manners and combinations. So take it as it is intended. This is just My experience and nothing else.
CPU - Antec Formula 7 using the
line methodGPU - Arctic MX4 using the
spread method (x method worked well too maybe even a degree or two cooler)
Memory chips + FET's (I think they are fets..anyhow whatever they are) - Used Antec Formula 7 in the
pea methodVery important...after applying the thermal pastes in these manners..DO NOT...repeat...DO NOT..push down on the heat pipes. Only gently place the heat pipes down and equally and evenly
without pushing down on them. I was doing that to ensure good contact and it actually was squishing all TIM from the cpu. The gpu was fine, but the cpu was squished out and then it seemed to me due to tension was microscopically lifting off the cpu once I was no longer pushing down with my finger and just letting the screw brackets hold down the pipes. This was causing a +12C temps difference on the cpu.
So again...just gently place the pipes evenly on the chips and then screw in the bracket screws in the order they are labeled. **Do not push down on the pipes at any time**
I used quite a bit of different TIM's . The reason I settled on Antec Formula 7 for the cpu and memory and fets was because it is a thicker paste and yielded the best temps. This was best combined with MX4 on the gpu with the spread method (x method worked equally well and maybe a degree cooler but I didn't feel like repasting yet again and just left it as spread).
When using the pea method on the memory and fets I used a more than typical amount you would use. The reason is because there is a slight gap because of the design which the factory used that goo as the bridge between the heat sinks and memory. The Antec Formula 7 is thick enough to stay put and soft enough to squish down to the proper thickness. This gets rid of the need to try different size thermal pads.
With all those mods and techniques the temps on this thing are perfectly acceptable.
The line method using Antec Formula 7 (**without pushing down on the pipes and just letting the brackets screw them down**) yields max temps of the cpu of 68C in Linux and 63C in Windows when only stressing the CPU (not loading up the gpu) in a 75.5 deg F room. That's darn good.
As soon as I figure a way to boost the fans in Linux, I'll report back. But at this point the temps are so good I'm not too concerned.
Anyhow...That's what I have come up with and it works very well. Hope it helps
SpookyWatcher
