That all depends on your level of competence.
I don't mean that as an attack on you, I have overhauled a few laptops with liquid metal the 2021 A15 FA506QR and a Legion 5 gen 6 I believe it is.
If your machine uses paste, it is likely due a refresh anyway. Liquid metal can make some fairly substantial gains over pastes on the whole but it comes with the risk of electrical damage if it gets where it shouldn't be. Conductonaut extreme is now commercially available and is touted as 20% better than standard conductonaut. It's a no brainer to use that if you're going for it.
Things to be mindful of, you do no need much liquid metal for it to work. The gallium in the LM will migrate to the copper and make an alloy on the surface. If being used on bare copper this is what you need to happen before assembly. My method is to clean up the cooling assembly and gently flat the coldplates with 800fgrit wet and dry. and then clean up thoroughly with isopropyl (Well away from your actual machine). Apply a excess of liquid metal to an area larger than the contact patch and then bake it in the oven for a few hours at about 90c. The flatting cleans and opens the surface of the copper making it more porous and the baking process will accelerate the alamgamation process. Once cool, gently wipe away excess, reapply a standard amount for use to the contact area and the dies themselves and you're good to go. If you do bake the assembly be sure to make sure there is no plastics on it. If the fans mount to the cooler, you need to remove them.
You can try to source a foam or sponge to act as a barrier to prevent spills, some use a thermal putty as it is easier to make a barrier with, others use a thicker paste like SYY 157. You will need to use a conformal coating on the SMDs around the chips matter less as that would be instant death should it get on those. You can also use Kapton tape, I always preferred a direct coating just to be sure.
You will also need to buy thermal putty for the VRMs and VRAM, messy and awkward but Upsiren UX Pro Ultra is one of if not the best putty on the market and will guarantee great contact and thermal transfer without impeding the cooling assembly mounting like trying to swap thermal pads can do.
If you know all of this and are just wondering.
Yes, it will make for a much cooler laptop, if you can OC the CPU you will get better overall performance from the thermal headroom. If you use MSI afterburner and undervolt and overclock the GPU you should also get better performance and cooler temps, especially when coupled with liquid metal.
