05-26-2020 03:34 AM
05-26-2020 08:57 AM
05-26-2020 10:32 AM
andreacos92 wrote:
With my G751JY, in these years, I used MX-4, IC Diamond and now I have Thermal Grizzly Kryonaut (repasted a month ago).
I had no problems with all of them and they are quite good in thermal performance.
Regards the GPU VRAM and VRMs, Asus used thermal paste and I suggest you to do the same.
I tried using 1.0 mm thermal pads, but I had the impression that the gap was so small that the pads thickness prevent the right contact between GPU die chip and the copper heatsink.
Maybe you can try with 0.5 mm thermal pads, I think they should work quite well.
05-27-2020 02:20 AM
Cannon.19 wrote:
Thank you. Have you had any problems when using thermal paste for VRAM and VRMs ?
And what brand of thermal pads should I look for if I decide to go with them?
mdzcpa wrote:
Just an observation. There is WAY to much paste applied in your photo. I am not sure who did that you in the past, but that is a MESS. Paste should be applied only to the center chip or integrated heat spreader. It should be a nice thin layer. It does not need to be applied in globs and blobs all around the area surrounding the CPU or GPU. In fact, doing so can make the chip run hotter.
05-27-2020 04:10 AM
andreacos92 wrote:
Until you use not conductive paste, you don't have any problems with thermal paste on VRAM and VRMs. And most of the well-known thermal paste are not conductive, so go with the one you can afford better in your country. Arctic MX-4, IC Diamond, Kryonaut are among the best, but the difference between a top-end compound and a medium compound is smaller than you can think. Go with a well known brand and make sure to apply it correctly, that makes the bigger difference.
+1
I didn't say that because I thought that was a photo taken from the web, but yes that was too much paste.
Anyway, with some thermal pastes you can spread on the chip, Thermal Grizzly suggests this method for example, because it is quite soft. But you have to be sure to create a thin and uniform layer at the same time, and it's not the easiest thing in the world.
On the other hand, you can go with the little pie at center of Die chip method, and then be sure to apply a good pressure with the heatspreader to make the paste spread well.
05-26-2020 03:22 PM
05-27-2020 12:07 AM
mdzcpa wrote:
Just an observation. There is WAY to much paste applied in your photo. I am not sure who did that you in the past, but that is a MESS. Paste should be applied only to the center chip or integrated heat spreader. It should be a nice thin layer. It does not need to be applied in globs and blobs all around the area surrounding the CPU or GPU. In fact, doing so can make the chip run hotter.
12-18-2023 10:20 PM
Arctic MX-4 shouldn't dry up as fast as you'd think, as long as there's full contact to the heatsink and avoiding any air exposure. The correct thickness of the thermal pads is 1mm for the vram and mosfets then 1.5mm for the vrm. I've had to find out through trial and error beginning with putting Arctic MX-4 on all chips needing TIM, then went from there to the pads and finding the correct thickness without losing full contact on the GPU and CPU.