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Repasted G750JX, shocking result.

Darnassus
Status Under Review
I just recently did a repaste on my G750 and it turns out my temps lowered down by a staggering 10-15*C BOTH on CPU and GPU

My past temps were 83 max record on the CPU and 82 on the GPU

EACH TEST WAS DONE FRESH AFTER REBOOT -- TEMPS RECORDED WITH CPUID HWMonitor

CPU used handbrake bench, before 83*C, after 71*C

GPU used Furmark (Burn In 15min 1920x1080) before 82*C, after 68*C


The process took me 6 hours, ( of course I will be careful ) but when I pulled off the GPU heat sink, there was crap EVERYWHERE.. all over the board, even under the plastic protectors of the chips.


They use this sort of weird.. "paste" looks like it's some blue-tack like strip you just put down, unless it's machine applied.. it looks extremely formal. It was practically dry in my understanding.. after 9 months use on low-end games ( I play stuff like Warcraft 3 mostly with my friends, and high-end games on the side, temps never exceeded 65-70 on the GPU Tweak report )

I was literally scraping off the old stuff with a paste spreader, it looked like a cracked wall, and crumbled like plaster.



Replaced with Arctic MX-4 (I didn't use silver, though I could have for the main chips on the die, but everything else was quite small and difficult not to make a mess, I didn't want to risk getting it onto the board.)

It looked like this when I first removed it
http://www.imagebam.com/image/da9b0e267647111

How it looks when applied during assembly?
http://rog.asus.com/wp-content/uploads/2013/08/GTX780M-heatsink-1.jpg


What ever that paste is that came stock, it's simply terrible.. 10*C I understand is quite the improvement. Also got a chance to clean out my fans which was nice.
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105 REPLIES 105

Darnassus
Status Under Review
Maybe it is a pad.. it's just, extremely pasty? It's so sticky.. literally, if you touched it, it would become stringy. It was like a toffee kind of consistency.

I guess they refer to it as a pad because it applies like a pad?

Anyway what ever they use is god damn rubbish. And it's definitely not silicon like the pads I'm familiar with.

Wulff
Level 9
i think its indeed some sort of sillicon thermal pad replacement like that k5 pro stuff out there, thats a bit the same i think, is a paste that you can use instead of a pad

this: http://www.ebay.nl/itm/K5-PRO-gummy-thermal-paste-grease-PS3-CECHAxx-RAM-thermal-pad-replacement-20g...

or at least something like that, but i wouldnt worry to much about using normal tim paste if there werent any gaps to be filled. probably as you said all automated applied and then some pre fabricated pad like thing would be fastest way for them to assemble perhaps

Darnassus
Status Under Review
Yeah puzzles me why it was only on the CPU. Still. I'm happy with the result. ;x

I don't think I'll have any hardware issues any time soon, since I'm always conditioning my unit during use. I wonder why I even bothered with 4 years warranty. I only ever have software problems. The screen ribbon is VERY loose, so it'll never get the flip-syndrome most laptops eventually get. The only thing I can think that'll ever happen is if I for some dumb reason decide to try upgrade my BIOS, of course with there being no reason to anyway.

Darnassus
Status Under Review
Did an early disassembly, turns out my paste dried out somehow, my MX-4 is either a bad tube, or I put too much on. Corrected it and fell back 12*C between benches. Down from 86 to 74 on Handbrake.

I've read a lot of threads that MX-4 dries out a lot, I thought it was supposed to be a 6-8 year long paste.

Anyone got ideas on how to maintain it's moisture? I just can't think of anything other than I applied it too thick my first time.

Also re torqued the screws.

Darnassus wrote:
Did an early disassembly, turns out my paste dried out somehow, my MX-4 is either a bad tube, or I put too much on. Corrected it and fell back 12*C between benches. Down from 86 to 74 on Handbrake.

I've read a lot of threads that MX-4 dries out a lot, I thought it was supposed to be a 6-8 year long paste.

Anyone got ideas on how to maintain it's moisture? I just can't think of anything other than I applied it too thick my first time.

Also re torqued the screws.


Darnassus, it might be the gaps between due to varying heights of the parts might be allowing more than normal edge exposure to the air.

The stuff that OEM's put in to bridge the gap, the goopy stuff, seems to turn rubbery on the outside which keeps it from drying out.

You might try ordering those replacement Asus compound PAD parts kits that someone listed earlier, I think there were 2 different ones per laptop.

I also posted some links to compound ratings earlier to your threads. There were a number of newer better performing compounds with better thermal characteristics - you could look them up and see what kinds of user reports they are getting about longevity and drying out.

Darnassus
Status Under Review
Little update..


Heat's picking up here, countries getting hot, so max temps recorded so far have been 75 never higher.. today I've been playing WoW on ultra, never went over 70 on either GPU or CPU


For my comment above, I must've applied way too much before and the thickness was 'caking'.

Retaining a good 8-10*C window still.

Wulff
Level 9
i emailed asusparts to verify the excact part number that would be needed

Darnassus
Status Under Review
No it's good Scott I just applied way too much on the CPU, I did a line method, plus spread method because I was scared of having too less.

It's going well now since.. the ambience when I did the test was around 20-24*C

Right now my temps are max record 68*C CPU and 76* on the GPU playing long hours on my games like WoW on absolute cranked up settings.

Ambiance right now is 39-40*C


Also twice my GPU hit 137*C on HWMonitor, is that a false reading? GPU Tweak says nothing about it. Only the max of 76. P.S. I found a proper working GPU Tweak..

Darnassus wrote:
No it's good Scott I just applied way too much on the CPU, I did a line method, plus spread method because I was scared of having too less.

It's going well now since.. the ambient when I did the test was around 20-24*C

Right now my temps are max record 68*C CPU and 76* on the GPU playing long hours on my games like WoW on absolute cranked up settings.

Ambiance right now is 39-40*C

Also twice my GPU hit 137*C on HWMonitor, is that a false reading? GPU Tweak says nothing about it. Only the max of 76. P.S. I found a proper working GPU Tweak..


Darnassus, too thick paste would do what you described. It takes an amazingly small amount of paste to work optimally - just enough to spread super thin after tightening - it looks like a sheer see through covering when done to the right thickness - even little holes of - too little to even call them gaps, but they are.

I use a strong business card that flexes - to drag across the surface of the paste to pull off as much as I can before putting it together.

Too much paste will not allow the heatsink / shim / plate to connect / seat completely and it won't tighten down all the way either - leaving a gap that air can get in and dry it all out.

It sounds like a HWMonitor buy, maybe back up to a stable version?

Which version of the Asus Tweak Tool for Graphics cards have you found is best?

Darnassus
Status Under Review
GPU Tweak 2.0.0 something. Very early edition.

It's the one that came stock on my unit, and I found it again.. honestly not sure WHY it needed updates.. can't figure out what'd need to be fixed on a simple OC program. Doesn't crash, reads my temps and everything properly.. thankfully I found it.


Yeah I had put on way too much I must admit. The CPU and GPU right now are sitting on 66 / 67 max on constant gameplay now that the ambient temps around here have dropped down to a nice 32*C.

I think I did a good, proper paste this time.. though maybe my application again was too thick, I did a spread, though I made sure I couldn't see the die, maybe I need to start using a card like you say, I'll find a dummy one somewhere and try it out for myself.

I keep forgetting that thermal paste is supposed to fill cavities and gaps, not actually make a 'bridge' between the two surfaces. I just worry what'll happen if I don't have enough..

Maybe doing the card method on both sides, on the die and the sink plate?