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Solder Thermal Interface Material for Intel's Next CPUs?

Hopper64
Level 15
Just saw this. Interesting read:

https://www.hardocp.com/article/2018/04/09/intel_rumors_kaby_lakex_skylakex_cascade_lake
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xeromist
Moderator
Seems like that would be smart. AMD is nipping at Intel's heels so not cheaping out on TIM seems like an easy way for Intel to salvage some extra headroom.
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Korth
Level 14
AMD already uses solder-based TIM on their higher-end Ryzens, lol.

But Intel will also benefit from solder-based TIMs making successful de-lids more difficult.

Good to have AMD kicking Intel around again. Even if they're always "second best" (which, arguably, they are not), they're still forcing Intel to up its game instead of continuing highway robbery and half-assed incremental R&D refinements.
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[/Korth]

Korth wrote:
AMD already uses solder-based TIM on their higher-end Ryzens, lol.


That's what I meant actually. Intel has been cheaping out and if they want to maintain the lead they need to step up and do it right as well.
A bus station is where a bus stops. A train station is where a train stops. On my desk, I have a work station…