I have an issue with my Rampage VI Extreme Encore which I think is design flaws as the issue prevents me from overclocking. I need input from the more knowledgeable person on this matter.
The cpu is 10980xe, basically the issue is under load the area around the vrm getting extremely hot. Much hotter than the vrm itself.
The electrolyte capacitors above the cpu socket went 5-10 degrees above the vrm temp and the substrate around the vccin delivery plane also getting similar temp.
I suspect the power plane traces on the board was not big enough to sustain the current/power draw from 18 cores cpu hence it heats up.
My first board started to throw lower vccin reading although it was running normally.
I noticed the melting plastic insulator around the cpu socket.
On new board it supposedly like this,
The second board I received from RMA burnt down like this,
So with my third board I start to monitor the board temp. I install temp sensor near the previously burnt component like this.
And the result is as mentioned it is super hot in my opinion. Without overclock the substrate/capacitors goes upwards of 73 degC depends on stress test used. And it is hotter than the vrm.
With very slight oc (200 mhz from all core 38 to 40) it went up to almost 80 degC.
I donâ€™t think this is normal. This board is the latest and supposedly the greatest yet it exhibit this unacceptable behaviour in my opinion.
Anyone have any idea whatâ€™s wrong? I donâ€™t dare to oc even 100 mhz let alone trying something like 4.6, 4.8 or even attempt 5.0...
Plenty of people overclocking 10980xe's to all core 5ghz on the Encore without issues. The Encore has the best VRM layout and cooling of all the X299 boards on the market.
Are you running the board without the VRM Heatsinks???
Are you using all the Supplemental power connections on the motherboard?
Sorry, but I am not the "more knowledgeable person on this matter." If no one steps forwards (Asus technical support or someone with a very similar so-called 'burnout' issue) then I seriously doubt a so-called "BIG DESIGN FLAW!"
The images you do show strongly suggest an issue with the i9-10980XE. Have you been using the same i9-10980XE CPU across all three MB's?
At the least. your images show melted plastics and an extremely remote possibility of melted solder! What CPU cooling solution are you using and is it certifiably on and running at least at 100%? I am not aware of any plastics, especially adjacent to the MB CPU that have melting points at, or below, 100C (more likely the melting point is >120C, or even >140C, that would be for polyethylene (e. g. PE, the stuff that most all shopping bags are made out of)).
Your 2nd MB shows extensive heat damage to the CPU socket itself, throughout the backside, and the triangular area of socket pins on the front side directly adjacent to the edge closest to the melted plastic.
The areas close to the top of the CPU (between the VRM and CPU) are known to get rather hot, most reviews show numbers in the 60C-70C range right next to the CPU (e. g. thermal imaging). Suggest you try another i9-10980XE if you have not done so already. Good luck.
Also. I hope you are using at least the AVX offsets that are the BIOS defaults, if not even larger offsets.