MatsGlobetrotter wrote:
I have now run my 4770K in my Maximus VI Formula with EK CPU cooler, EK chipset cooler, GTX780Ti with EK fullblock cooler, EK block on MOSFETS for about 2 months. I have tested putting the CPU to be directly after the pump vs having it directly after the XTX360 radiators. I am using the EKWB 4.0 Pump which has somewhat good pressure. Everything is in one loop and the GPU is running cool after the CPU which is the direct limiting factor on heat now.
I have ordered the liquid metal so will redo the de-lidding which should give me a better result.
But then what?
Would it be to add another 360 radiator with more fans or would it be getting a mega pump to get a superflow? knowing that the GPU runs full time at 1.212 Volts fully stable in any benchmark (40C) and I cant physically get more voltages out of the card without a hardware modification I am questioning if making 2 loops really worth the extra hardware or would it be more cosmetic improvements. Am I really using the radiators to the max or would a higher flow be able to get cooler water to the CPU or is the radiator the real limiting factor rather than the flow?
At this juncture what is the real limiting factor in the system to get the CPU heat down which seems to be the stopping block in all tests I have done.
In the end I am planning to get a Hailea 500A to get some properly cool water but at this time I am more looking at the fastest system I can get into the corsair 900D for a 24/7 operation without such additional cooling system. I am not into filling the case up for the cosmetics, thus interested in just what makes the most sense performance wise.
Any ideas ? any hints on where i can read more info on such? I keep searching on the web but have no real conclusive answers yet.
Mats,
I still like the looks of your rig as I said in the world cup thread. It's even better with the power cables connected - they're colorful. Your scores are high and plentiful. Your standing on the team speaks for itself. My comments are mostly 'you're good enough' with only one suggestion.
Note that if you use a chiller, you will be in the OC league at HWBOT, no longer in the enthusiast league.
You got the first thing -- liquid metal -- on the way. After or as part of delidding, that makes the biggest difference in my experience. The liquid metal is rated to conduct 9 times more watts of heat than the best of the others. (82 W/mK vs 9) I use the liquid metal between lid and chip and between lid and waterblock. Neither place gives me a thermal bottleneck. Be sure to cover that row of tiny parts near the chip with nail polish or silicon caulk to keep the electrically conductive liquid metal away. The liquid metal WILL squish out and run down the side of the chip.
As an example, for this week's world cup challenge, I ran Realbench at 4800MHz with insane 1.65Vcore. The CPU drew over 185 watts, but stayed under 83C. I have a lot of confidence in a watercooling rig with delidding and liquid metal.
Two loops, series/parallel splits and the like make very little difference as long as the pump keeps the water moving well enough, which yours should be doing.
Added radiators can make a difference. Water temperature rise depends on the difference between watts of power into the water and watts out through the radiator. Do you have a sensor for water temperature? There must always be temperature differences from CPU to waterblock to water to radiator to air. Temperature difference is what drives heat through the cooling system. Water temperature will rise to the point needed to get the watts out through the radiator. More radiator area lets the heat get out with lower water temperature. Lower temperature water will cool the CPU better, degree for degree.
http://koolance.com/radiator-2-fan-140mm-30-fpi-copperThe specification tab on the page above shows this quantified to an extent. Water flow rate has an effect and so does air flow. Note that the biggest difference is in the size of the radiator -- 1 vs 2 vs 3 fans. The same happens when radiators are added -- total size provides a path for power to get out and sets the temperature difference required. The bottom line is that a good 2x140mm radiator like mine keeps water temperature below 34C in extended benching with room air at 28C. That's cooling the CPU and M6F VRMs. Water can keep the chipset cool, but there aren't many watts there. You also cool the GPU. That can add more watts than the CPU and call for a whole second radiator. For that whole load, I would use 2 2x140mm or 2 3x120mm radiators. If that's what you have, you probably don't need more. With that huge case, a third radiator might fit easily make a contribution. It depends on water temperature.
The only suggestion I have is to cool the RAM. Some use little air fans blowing down on the sticks. From what I read about it, I have my eye on an EK RAM watercooler that's built to sit on the heat spreaders of Dominators. They also have replacement heat spreaders to work with other models like mine. That could add another 20 watts from two RAM sticks to the water -- not enough to drive increasing the radiator.
The advantage to cooling ram is that there is room for some tweaking when the memory chips stay cool -- particularly in a shorter refresh interval.
Hope this rambling helps.
Jeff