I saw that video too with roman. damn. I cant believe they made the die that thick, 2x thicker than 8th gen, and then solder. it is like nothing was accomplished with the soldering when they made the die that big. I get that they needed a new die for 8 cores but damn, they could have halved it in thickness... imagine what would happen to the 9th gen if they didn't solder haha it would burn...
a delid is coming in the future, and liquid metal might be the choice. just deleting the silicone layer around the IHS and putting some good paste does a lot!
and it seems that Bronson you might be stuck at 4.9 if you are happy there why bother. I know, it feels sad not getting 5.0. but it is soon forgotten 🙂 (bclk adjustment?) 😉
peace