12-30-2016 04:31 PM - last edited on 03-05-2024 10:54 PM by ROGBot
12-31-2016 03:13 PM
01-01-2017 07:45 PM
01-02-2017 05:32 AM
JustinThyme wrote:
He covered temps and cooling in the first post.***
01-02-2017 12:07 PM
quark54 wrote:
Apologies, no idea how I missed that.
There are so many inconsistent reports re Kaby Lake, some claiming high temps and some not, I'm beginning to wonder if there's inconsistency regarding the Die/IHS interface. I recall similar issues when Skylake was released. Just speculating.
When Skylake was released there were also plenty of reports of 5 GHz. I'm thinking the true picture will emerge in a few months time when a multitude of owners recount their experiences.
As Menthol said.. he may have a good chip, may have been lucky in the silicone lottery.
01-03-2017 02:41 AM
JustinThyme wrote:
Judging from his temps with WC I would say the IHS interface is still an issue. Note also he said he hasn't delided his 7700K yet. Its a shame that intel makes this sacrifice to save in production costs. Their only obligation is that the chip makes its advertised specs, nothing more. My Skylake was all over the place and spiking extremely high. It would jump 40-55C just sitting at idle and peak at 90C with a mild-moderate OC until I yanked the IHS and gave it the royal treatment. After the same chip idles at 30C and deosnt move more than 1-2C at idle and with the same mild to moderate OC of 4.6GHz it peaks at 60C.
Intel has some of the best engineers in the world when it comes to metallurgy. They know exactly what they are doing and the reason for conventional thermal paste in recent desktop CPUs is not as simple as it seems.
Micro cracks in solder preforms can damage the CPU permanently after a certain amount of thermal cycles and time. Conventional thermal paste doesn’t perform as good as the solder preform but it should have a longer durability – especially for small size DIE CPUs.
Thinking about the ecology it makes sense to use conventional thermal paste. Gold and indium are rare and expensive materials. Mining of these materials is complex and in addition it’s polluting.
After soldering one of my 6700K CPUs I can tell it’s a pretty complex process. I’m still working on it and trying to make it available for extreme overclockers. However, I doubt that Intel will come back with soldered “small DIE CPUs”. Skylake works great even with normal thermal paste so I see no reason why Intel should/would change anything here.
Judging from his temps with WC I would say the IHS interface is still an issue.
01-07-2017 06:34 PM
quark54 wrote:
Mid 70's is an excellent temp at 5GHz with this cooler. Hence why he said he may not bother to delid The H115i is only 4 or 5 degrees cooler than my D15. It's the variation in thermals from review to review that make me consider the IHS/Die interface issue.
01-02-2017 06:11 AM