Latest C7H BIOS

[Shamino]

https://www.dropbox.com/s/k2beo11w1kw7kus/ROG-CROSSHAIR-VII-HERO-WIFI-ASUS-0068.rar?dl=0

[Lothos]

OMG, can the two of you stop measuring eachother up. At some point I am going to ask that you get a room together.

The question was about those thermal pads instead of using paste.

EZ_PC_TECH, believes they are non-sense but there are several on the market and it has over 600 reviews which an extremely high rating. I am asking if anyone has tried these on a Ryzen CPU and what were the results when compared to thermal compound?

EDITED: I found this article https://graphicscardhub.com/best-thermal-pad/

Hmm, also found this youtube video
https://www.youtube.com/watch?v=YpphKzmDiJM

[EZ_PC_TECH]

Lothos wrote:
OMG, can the two of you stop measuring eachother up. At some point I am going to ask that you get a room together.

The question was about those thermal pads instead of using paste.

EZ_PC_TECH, believes they are non-sense but there are several on the market and it has over 600 reviews which an extremely high rating. I am asking if anyone has tried these on a Ryzen CPU and what were the results when compared to thermal compound?

EDITED: I found this article https://graphicscardhub.com/best-thermal-pad/

Hmm, also found this youtube video
https://www.youtube.com/watch?v=YpphKzmDiJM

I'm not saying that they are nonsense, they definatly will be useful for some, I just said that the thermal compound will most likely give you better results which makes sense since TIM can fill the microcavities, unlike the pad. Unless you'll add some thermal paste to both sides (I do this with most of the pads I use for GPU, VRM, VRAM, etc), but then it's not clear what is the purpose of that pad at the first place. In the case of VRAM, you need to fill the 0.5mm+ gap, and the pad is necessary, while with CPU we need as direct contact as it just possible.
BTW: Look at the bad review first https://www.amazon.com/product-reviews/B07CK9SHZG/ref=acr_dp_hist_1?ie=UTF8&filterByStar=one_star&re...
On Amazon, quite often people giving a good review for sort of giveaway. Those "free stuff reviewers" unlikely will give 1 star for the product, while people who really paid for it will do it without hesitation.

[MattTheTech]

EZ_PC_TECH wrote:
I'm not saying that they are nonsense, they definatly will be useful for some, I just said that the thermal compound will most likely give you better results which makes sense since TIM can fill the microcavities, unlike the pad. Unless you'll add some thermal paste to both sides (I do this with most of the pads I use for GPU, VRM, VRAM, etc), but then it's not clear what is the purpose of that pad at the first place. In the case of VRAM, you need to fill the 0.5mm+ gap, and the pad is necessary, while with CPU we need as direct contact as it just possible.
BTW: Look at the bad review first https://www.amazon.com/product-reviews/B07CK9SHZG/ref=acr_dp_hist_1?ie=UTF8&filterByStar=one_star&re...
On Amazon, quite often people giving a good review for sort of giveaway. Those "free stuff reviewers" unlikely will give 1 star for the product, while people who really paid for it will do it without hesitation.

For what its worth, Your Method Of Applying Thermal Paste is among the best for Zen 2 Specifically. It won't hurt on Zen or Zen+ Either because of the CCX Positions, but for Zen 2, if you don't Manually Spread the Thermal Paste Across the Entire IHS, than your Method is definitely the best.

That said Spreading a Thin Layer of your Preferred Thermal Paste across the entire IHS, and then Applying EVEN pressure across the IHS while Mounting Your Cooling Element, is the most consisent method of applying thermal paste, no matter the CPU/GPU Architecture. But again, using your method, and making sure to Apply Even Pressure while mounting your cooler, will also give you pretty similar results.

Regarding Thermal Pads, I have started to use them in my lab. I would not recommend for Zen2 if Overclocking. They work, and well, and will give you consistent results when running Thermal Tests across a wide sample of CPU's, where the goal is to limit the variable of your Thermal Compound Application. This is where these new Thermal Pads, in particular the new Thermal Grizzly Ones (They are among the best I have tested, although admittedly I have only tested a handful of others) really shine. You can Run your Thermal Stress Tests on your CPU and collect your data, unmount the cooling solution, remove the thermal pad, replace either the same thermal pad or another from the same batch, Remount the Cooler (and don't have to pay much attention to applying even Pressure while Mounting) fire up the same tests, repeat the process 10 times on the same CPU and end up with damn near the same exact results when accounting for Room Ambient. This consistency is hands down the most amazing thing about these pads. Then when you need to collect data across a wide range of CPU's, having that consistency with your Thermal Interface, allows you to more directly compare your data and draw fairly accurate conclusions.

That said, again if your goal is to get the best Overclock out of your system, whether its your daily driver, or its for an OC Competition of some sort, then your will be able to get better results with high quality thermal paste. Its not worlds better, but every .1c helps when you are trying to get the most out of your CPU, and as long as you apply even pressure, and make sure the entire IHS is Covered, You will almost always get better results with Say Kryonaut or Thermal Right, then you will with a thermal Pad.

Anyways, sounds like you guys probably already know this, so not even sure why I butted in, other to say you guys are both right. Happy OCing!!!

[RNG_AGESA]

any news beside thermal paste?
my enthusiast heart would like to try out enthusiast AGESA 1.0.0.4(B) over the holidays.
How are the chances to get an unbroken AGESA? rhetorical question..

[Zefram]

I dont know what the changes are but the 3004 bios is released.
CH7 https://dlcdnets.asus.com/pub/ASUS/mb/SocketAM4/ROG_CROSSHAIR-VII-HERO/ROG-CROSSHAIR-VII-HERO-ASUS-3...
CH7 Wifi https://dlcdnets.asus.com/pub/ASUS/mb/SocketAM4/ROG_CROSSHAIR-VII-HERO_WI-FI/ROG-CROSSHAIR-VII-HERO-...

[isee133]

Zefram wrote:
I dont know what the changes are but the 3004 bios is released.
CH7 https://dlcdnets.asus.com/pub/ASUS/mb/SocketAM4/ROG_CROSSHAIR-VII-HERO/ROG-CROSSHAIR-VII-HERO-ASUS-3...
CH7 Wifi https://dlcdnets.asus.com/pub/ASUS/mb/SocketAM4/ROG_CROSSHAIR-VII-HERO_WI-FI/ROG-CROSSHAIR-VII-HERO-...

It's already up on the german support site:
https://www.asus.com/de/Motherboards/ROG-CROSSHAIR-VII-HERO-WI-FI/HelpDesk_BIOS/

Notes:
ROG CROSSHAIR VII HERO(WI-FI) BIOS 3004
1. Update AM4 combo PI 1.0.0.4 patch B
2. Fixed a compatibility issue with M.2s when using Ryzen 3000 CPUs.

[amadeus1171]

Anything else I should be afraid of?

[mimosoft]

With "1usmus ryzen power plan" or "AMD Ryzen balanced power plan" my 3900X doesn't clock below 3717MHz with Bios 3004. If i activate "energy saving mode power plan" it clocks down. 😞

[isee133]

mimosoft wrote:
With "1usmus ryzen power plan" or "AMD Ryzen balanced power plan" my 3900X doesn't clock below 3717MHz with Bios 3004. If i activate "energy saving mode power plan" it clocks down. 😞

I no longer see them going into "sleep" on both the Ryzen Balanced and Ryzen High Performance Power plan, but they are going down to 300-400MHz according to Ryzen Master and voltage is also going down to 1.1V.

[mimosoft]

isee133 wrote:
I no longer see them going into "sleep" on both the Ryzen Balanced and Ryzen High Performance Power plan, but they are going down to 300-400MHz according to Ryzen Master and voltage is also going down to 1.1V.

Yes. It's the same on my pc.